CMP Process Materials
In Maxwaytec Engineering, we have more than 10 years working experiences in CMP process, this include provides CMP machine overhaul and supplying CMP process materials. Chemical Mechanical Planarization (CMP) is a critical process in order to determine smooth surface requirements.
Maxwaytec Engineering offers 2 key materials for CMP process, namely
- CMP pad
Both commodities serve the key process materials which direct impact the product quality. Since we are very close to our customers, we are able to provide a product developing in order to upgrade our product range to suit for next generation surface quality.
CMP Pad Materials
Currently, we have CMP-600 and CMP-800 pad for the semiconductor industry. Both designed pads
The CMP-600 pad comes with a 10*10mm groove pattern. In general, we are seeing some advantages for using the grooved pad on a CMP process which required higher stock removal. This is due to
- The groove is acted as an effective channel for debris discharge.
- Able to increase higher slurry flow rate
- Increase stock removal rate
Slurry uses in CMP Process
Slurry plays an important role in a CMP process. The CMP pad may contribute mainly on mechanical effect, however, the slurry contribute both in mechanical and chemical effect. The slurry particle abrasive will direct contribute the removal rate mechanically, and the slurry solution base will contribute the etching effect from chemical perspective.
We have 2 major groups of slurry available:
- Silicon Oxide base slurry
- Colloidal silica base slurry
Both type of slurry have been proof in achieving better surface appearance and lower surface defective rate.
Kindly talk to Maxwaytec for your CMP process material needs.